MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678
Microstructure Control in Sn–0.7 mass%Cu Alloys
Kazuhiro NogitaJonathan ReadTetsuro NishimuraKeith SweatmanShoichi SuenagaArne K. Dahle
Author information
JOURNALS FREE ACCESS

2005 Volume 46 Issue 11 Pages 2419-2425

Details
Abstract

Soldering alloys based on the Sn–Cu alloy system are amongst the most favourable lead-free alternatives due to a range of attractive properties. Trace additions of Ni have been found to significantly improve the soldering characteristics of these alloys (reduced bridging etc.). This paper examines the mechanisms underlying the improvement in soldering properties of Sn–0.7 mass%Cu eutectic alloys modified with concentrations of Ni ranging from 0 to 1000 ppm. The alloys were investigated by thermal analysis during solidification, as well as optical/SEM microanalyses of fully solidified samples and samples quenched during solidification. It is concluded that Ni additions dramatically alter the nucleation patterns and solidification behaviour of the Sn–Cu6Sn5 eutectic and that these changes are related to the superior soldering characteristics of the Ni-modified Sn–0.7 mass%Cu alloys.

Information related to the author
© 2005 The Japan Institute of Metals and Materials
Previous article Next article
feedback
Top