MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
Microstructure and Thermoelectric Properties of Hot-Pressed n-Type Bi1.9Sb0.1Te2.6Se0.4 Alloys Prepared Using a Rapid Solidification Technique
Yuma HorioHiroyuki YamashitaTakahiro Hayashi
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2005 Volume 46 Issue 11 Pages 2525-2529

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Abstract

N-type Bi1.9Sb0.1Te2.6Se0.4 alloys were prepared by a rapid solidification technique and subsequent hot-pressing method. The microstructure and thermoelectric properties of the alloys were investigated as a function of the hot-pressing temperature and pressure. The X-ray diffraction measurements indicate that the grains are preferably aligned with the c-axis perpendicular to the direction of the hot-pressing force by the hot-pressing. Hot-pressing at higher temperature promotes the grain growth in the alloys. The Seebeck coefficient (α) and electrical resistivity (ρ) decrease with an increase in the hot-pressing temperature, whereas the thermal conductivity (κ) increases. The specimens prepared at higher temperature greater than 733 K show better thermoelectric performance: the largest dimensionless figure of merit (ZT) is 1.08 at room temperature.

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© 2005 The Japan Institute of Metals and Materials
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