MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678
Effect of Surface Asperity on Diffusion Bonding
Airu WangOsamu OhashiKenji Ueno
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2006 Volume 47 Issue 1 Pages 179-184

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Abstract

The effect of surface asperity (mainly ridge height H, ridge wavelength W and aspect ratio HW) on the diffusion bonding process was investigated. Ridge wavelength W as well as ridge height H have a significant effect on the properties of the diffusion bonded joint. The percent of bonded area increased with decreases in W and H. When the ridge height H was constant, an increase in aspect ratio HW accelerated atomic diffusion at void surfaces and bonding interfaces, facilitated void shrinking and increased the bonded area. This can improve the strength of diffusion bonded joints. The percent of bonded area can be predicted by numerical analysis for surfaces prepared by lathe machining.

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© 2006 The Japan Institute of Metals and Materials
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