Abstract
The stresses and the textures of electroplated copper films were studied using the X-ray diffraction analysis. The results show that the stresses in the films are always tensile. The films have (110) fiber texture at different thickness from 8 to 60 μm. From strain energy minimization point of view, the grains with (110) orientation should be favorable in these films. A further planar texture on top of the fiber texture was developed. It could be explained by elastic anisotropy at different orientation in grain.
