MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678
Dynamic and Static Restoration Behaviors of Pure Lead and Tin in the Ambient Temperature Range
Satoshi HottaKeigo MatsumotoTaichi MurakamiTakayuki NarushimaChiaki Ouchi
Author information
JOURNALS FREE ACCESS

2007 Volume 48 Issue 10 Pages 2665-2673

Details
Abstract

Dynamic and static restoration behaviors of pure lead and tin were investigated by compression tests, and the deformation temperature and strain rate were varied in the range from 223 to 348 K and from 2×10−3 to 1 s−1, respectively. Lead and tin used had two purity levels of 99.999% (5N) and 99.9% (3N), and 5N and 4N, respectively. The hot working simulator was reformed so as to enable compression tests at low temperatures ranged from 223 to 273 K. S-S curves observed in lead and tin were those in dynamic recrystallization and dynamic recovery types of metals, respectively, of which activation energies were 92 to 119 kJ/mol in lead and 49 to 52 kJ/mol in tin. Steady state flow stress in lead with 5N purity was lower than that of tin with 5N purity. A reduction of purity level from 5N to 3N in lead significantly increased flow stress, but difference in purity level of 5N and 4N in tin exerted tiny influence on flow stress at strain rate below 1×10−1 s−1. Static recrystallization in lead with 5N purity completed in the holding time of less than 600 s even at 273 K, while tin with the same purity showed a slightly retarded recrystallization progress. A reduction of purity level in both metals extended the time period for completion of recrystallization by more than 2 orders.

Information related to the author
© 2007 The Japan Institute of Metals and Materials
Previous article Next article
feedback
Top