MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
SEM In Situ Study on Deformation Behavior of Cu and Cu/Ni Films under Three-Point Bending
Jianguo HuangXishu WangXiangkang Meng
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2007 Volume 48 Issue 10 Pages 2795-2798

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Abstract

The deformation and failure of Cu and Cu/Ni film/substrate structure were studied by the scanning electron microscope (SEM) in situ observation under three-point bending. It was found that the rapid deformation occurred at sites near to the interface of film/substrate in Cu and Cu/Ni films. The transferring of deformation finally caused the surface wrinkle. The wrinkle stress can be expressed as σwf=k(EfEs2)1⁄3. Based on the results in mesoscale, a simple failure mechanism of films/substrate structure is suggested to understand the transferring process of deformation and failure characteristics.

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© 2007 The Japan Institute of Metals and Materials
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