Hydrogenation Induced Bending Motion of Composite Device of La-Ni Alloy Film Deposited on Copper Foil

Abstract

In order to obtain a large movement with high power and responsiveness, a hydrogenation operated bimetal device made of La-Ni alloy film deposited on a thin copper (Cu) substrate foil, has been successfully developed. The sample of La-Ni film deposited on the Cu thin foil exhibits about 50% larger bending displacement than that on a thick sheet of polyimide substrate within 50 s. The influence of load on bending motion has also been investigated. The moving yield of the La-Ni film deposited on the Cu thin foil is larger than that on a polyimide thick sheet.