MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678
Pb-Free Silver Conductive Paste with High Reliability
Kazutaka NakayamaAtsushi NagaiNoritaka Iida
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2007 Volume 48 Issue 3 Pages 594-599

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Abstract

We have been engaged in developmental activities aimed at improving the properties of Ag conductive paste which can be used for various kinds of electronic components including circuit boards and both chip and high frequency components. By applying the uniform ceramic coating technology to Ag powder, we produced a variety of options to achieving the goal of lead elimination. The properties, namely solder leaching, adhesives strength (aging, heat cycles, strength in high heat and humidity) and migration, have successfully been improved to a level which is the same or higher than those of Ag/Pd (80/20) and Ag/Pt (99/1), which are currently used for conductive paste material. In this study, we succeeded in eliminating not only lead, but also frit, which, as a result, paves the way for the application of Ag conductive paste to high-frequency components, LTCC (Low Temperature Co-fired Ceramic) terminations and surface electrodes.

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© 2007 The Japan Institute of Metals and Materials
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