Abstract
We have been engaged in developmental activities aimed at improving the properties of Ag conductive paste which can be used for various kinds of electronic components including circuit boards and both chip and high frequency components. By applying the uniform ceramic coating technology to Ag powder, we produced a variety of options to achieving the goal of lead elimination. The properties, namely solder leaching, adhesives strength (aging, heat cycles, strength in high heat and humidity) and migration, have successfully been improved to a level which is the same or higher than those of Ag/Pd (80/20) and Ag/Pt (99/1), which are currently used for conductive paste material. In this study, we succeeded in eliminating not only lead, but also frit, which, as a result, paves the way for the application of Ag conductive paste to high-frequency components, LTCC (Low Temperature Co-fired Ceramic) terminations and surface electrodes.
