MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
Grain Boundary Structure of Ultrafine Grained Pure Copper Fabricated by Accumulative Roll Bonding
Ken-ichi IkedaKousuke YamadaNaoki TakataFuyuki YoshidaHideharu NakashimaNobuhiro Tsuji
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2008 Volume 49 Issue 1 Pages 24-30

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Abstract

Grain boundary structures of ultrafine grained pure copper (Cu) fabricated by the accumulative roll bonding (ARB) have been studied. The atomic structures of grain boundaries in the ARB processed Cu (ARB-Cu) were observed by high resolution electron microscopy. In order to compare the grain boundaries in the ARB-Cu with equilibrium grain boundaries, the grain boundary energy and structure of symmetric tilt boundaries with ⟨110⟩ common axis in pure Cu were computed by molecular dynamics simulation (MD). The low angle boundaries in the ARB-Cu were basically described by conventional dislocation model and simultaneously there were some local structures having certainly high energy configurations. The grain boundaries with large misorientation in the ARB-Cu are basically described by the structural units predicted for the normal grain boundaries by MD. The present results indicate that the atomic structures of the boundaries in the Cu severely deformed by the ARB are rather similar to those of the equilibrium grain boundaries, except for the local distortions.

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© 2008 The Japan Institute of Metals and Materials
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