Bonding Technique Using Micro-Scaled Silver-Oxide Particles for In-Situ Formation of Silver Nanoparticles

Abstract

We investigated a new bonding technique utilizing micro-scaled silver-oxide (Ag₂O) particles. The results of our investigations revealed that bonding between electrodes using for semiconductor modules can be accomplished by adding myristyl alcohol to silver-oxide particles, followed by heating the mixture in air at 300°C under a pressure of 2.5 MPa. Since this bonding technique produces silver particles with a size of a few nanometers when the silver oxide is reduced by the presence of the alcohol, low-temperature sintering and bonding can be achieved.