MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678
Characteristics of Zn-Al-Cu Alloys for High Temperature Solder Application
Seong-Jun KimKeun-Soo KimSun-Sik KimChung-Yun KangKatsuaki Suganuma
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2008 Volume 49 Issue 7 Pages 1531-1536

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Abstract

Melting range, microstructure, mechanical properties and spreadabililty of Zn-(4∼6 mass%)Al-(1∼6 mass%)Cu alloys were investigated. Liquidus temperature was targeted between 655 and 675 K, and solidus temperature was targeted to 645 K. The liquidus temperature of the Zn-Al-Cu solders increased with Cu contents, but it decreased with Al contents. Microstructures of the Zn-Al-Cu solders consisted of primary ε-phase (CuZn4), η-phase (Zn matrix), α-η eutectic phase (Zn-Al eutectic) and ε-η eutectic phase (Zn-Cu eutectic), irrespective of the Al and Cu contents. Increasing the Al and Cu contents, hardness and tensile strength increased, but elongation decreased. The Al content played an important role in improving the spread ratio, the Cu content had no significant influence on the spread ratio.

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© 2008 The Japan Institute of Metals and Materials
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