Abstract
The influence of Ag on the kinetics of the solid-state reactive diffusion between Pd and Sn was experimentally examined using Sn/(Pd–Ag)/Sn diffusion couples with a Ag concentration of 75 at% in the present study. The diffusion couples were isothermally annealed at temperatures of 433, 453 and 473 K for various periods up to 1365 h. During annealing, a compound layer dominantly consisting of polycrystalline PdSn4 and Ag3Sn lamellae is formed at the (Pd–Ag)/Sn interface in the diffusion couple. The square of the thickness of the compound layer increases in proportion to the annealing time. This relationship is called the parabolic relationship. On the other hand, the interlamellar spacing in the compound layer is proportional to a power function of the annealing time, and thus grain growth occurs in the compound layer. The exponent of the power function is close to 1/3. The parabolic relationship of the layer growth and the occurrence of the grain growth guarantee that the growth of the compound layer is controlled by volume diffusion. The addition of Ag with 75 at% into Pd decreases the parabolic coefficient by 93, 88 and 78% at 433, 453 and 473 K, respectively. Hence, Ag works as an effective suppressant against the growth of the compound during the solid-state reactive diffusion between Pd and Sn.
