MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
Wettability of Low Silver Content Lead-Free Solder Alloy
I Gusti Bagus Budi DharmaMohd Hamdi Abd ShukorTadashi Ariga
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JOURNALS FREE ACCESS

2009 Volume 50 Issue 5 Pages 1135-1138

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Abstract

Wettability of low silver (Ag) content Sn-xAg-0.7Cu-0.5In lead-free solder (x=0.1,0.3,0.5) on copper substrate was investigated. Wetting balance test results indicated that varying small Ag content in the alloy affects the wettability of solders with higher Ag content showing better wettability. The contact angles of the solder alloy showed dependence on Ag content in solder and temperature. Solder alloy with no Ag content and 0.5 mass% Ag content displayed similar contact angle and qualitatively similar surface tension; however, the maximum wetting force is significantly difference, which indicates difference in the density of solder alloy. Effects of different fluxes on wettability were also studied.

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© 2009 The Japan Institute of Metals and Materials
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