2009 年 50 巻 8 号 p. 2111-2114
The influence of applied pressures on temperature distribution in punch/die/graphite/sample assembly during SPS current control mode operation was systematically investigated by coupling experiments and computer modeling. Combined experimental and numerical results showed that the peak temperature and the temperature difference existing between the sample and the die outer surface progressively decreased with increasing of applied pressure from 5 to 80 MPa. This behavior was attributed to the strong change of the electric and thermal contact resistances at the punch/die interface due to punch Poisson deformation.
