MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678
Bonding Quality of Copper-Nickel Fine Clad Metal Prepared by Surface Activated Bonding
Kyung Hoon KimSoon Hyung HongSeung Il ChaSung Chul LimHyouk Chon KwonWon Kyu Yoon
Author information
JOURNALS FREE ACCESS

2010 Volume 51 Issue 4 Pages 787-792

Details
Abstract

The effects of surface roughness and heat treatment on the bonding quality of surface-activated bonding (SAB)-treated copper-nickel fine clad metals were investigated. An increase in the surface roughness of the copper layer decreased the peel strength after cladding, indicating that increases in the surface roughness decreased the contact area between the clad materials in the SAB cladding process, unlike conventional cold rolling that induces high deformation. In addition, the peel strength of the clad metals increased up to 7.3 N/mm with decreasing surface roughness of the copper layer after heat treatment. The change in the total sheet resistance of the copper-nickel clad metal with the heat treatment depended on the balance between a decrease in the sheet resistance due to the reduction of dislocation and the increase in the heat treatment temperature, and an increase in the sheet resistance due to the diffusion of nickel in the copper direction.

Information related to the author
© 2010 The Japan Institute of Metals and Materials
Previous article Next article
feedback
Top