Changes in Strength and Microstructure of Cu (100) [001] Single Crystals Caused by Accumulative Roll-Bonding

Akari Yoshida; Yoji Miyajima; Susumu Onaka

doi:10.2320/matertrans.MD201116

Akari Yoshida, Yoji Miyajima, Susumu Onaka

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Keywords: severe plastic deformation, ultrafine grain, copper, microstructure, grain boundary, single crystal

JOURNAL FREE ACCESS

2012 Volume 53 Issue 1 Pages 26-29

DOI https://doi.org/10.2320/matertrans.MD201116

View "Advance Publication" version (November 30, 2011).

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Abstract

Plate-like copper single crystals with (100) [001] orientation were subjected up to nine cycles of the ARB process. Ultrafine grains less than 1 µm were obtained in the single crystal ARB processed by six cycles. Changes in strength and microstructure of the ARB processed single crystals are compared with those of the ARB processed polycrystals. Origins of high strength of the ARB processed single crystals are discussed.

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