MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678
Characteristics of Graphene-Filled Solderable Isotropically Conductive Adhesive (ICA)
Byung-Seung YimSeung-Hoon OhJiwon KimJooheon KimJong-Min Kim
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2012 Volume 53 Issue 3 Pages 578-581

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Abstract

A new class of functionalized graphene-filled solderable isotropically conductive adhesive (ICA) has been developed using a low-melting-point alloy (LMPA) fillers. The mechanical and electrical characteristics of formulated ICAs were investigated and compared with those of three kinds of conventional ICAs filled with Ag particles. The functionalized graphene-filled solderable ICA formed good metallurgical interconnection between upper and corresponding lower electrode. The developed ICA exhibit lower electrical resistance and higher mechanical strength compared with those of conventional ICAs. In addition, the thermal conductivity was improved about 20% by adding functionalized graphene compared with that of solderable ICA without graphene.

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© 2012 The Japan Institute of Metals and Materials
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