Low-Temperature Bonding of Silver Derived from Silver–Oxide Particles to Nickel

Yusuke Yasuda; Eiichi Ide; Toshiaki Morita

doi:10.2320/matertrans.M2013083

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Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678

Low-Temperature Bonding of Silver Derived from Silver–Oxide Particles to Nickel

Yusuke Yasuda, Eiichi Ide, Toshiaki Morita

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Keywords: silver oxide, bonding, reduction, sintering

JOURNAL FREE ACCESS

2013 Volume 54 Issue 6 Pages 1063-1065

DOI https://doi.org/10.2320/matertrans.M2013083

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Abstract

Silver was bonded to nickel by using silver–oxide particles with cetyl alcohol as a bonding material for bonding at 350°C under H₂. The shear strength of the bonds formed with the joining medium of silver oxide/cetyl alcohol was 27.1 MPa. Sintered silver was bonded to nickel without the oxide layer that ensured the sintered silver was strongly bonded to nickel, which was confirmed by cross-sectional transmission electron microscopy.

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