MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
Low-Temperature Bonding of Silver Derived from Silver–Oxide Particles to Nickel
Yusuke YasudaEiichi IdeToshiaki Morita
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2013 Volume 54 Issue 6 Pages 1063-1065

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Abstract

Silver was bonded to nickel by using silver–oxide particles with cetyl alcohol as a bonding material for bonding at 350°C under H2. The shear strength of the bonds formed with the joining medium of silver oxide/cetyl alcohol was 27.1 MPa. Sintered silver was bonded to nickel without the oxide layer that ensured the sintered silver was strongly bonded to nickel, which was confirmed by cross-sectional transmission electron microscopy.

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© 2013 The Japan Institute of Metals and Materials
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