MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678
Surface Mounting Process Using Hybrid Resin Sheet Including Self-Organizable Solder Particles
Shinji FukumotoShu InoueRyoichi WakimotoYuto YamamotoMichiya MatsushimaKozo Fujimoto
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2013 Volume 54 Issue 6 Pages 899-904

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Abstract

To ensure the robustness of surface-mount technology, underfill resin should be applied between the chip device and the substrate. However, this application process is time consuming. Therefore, a novel chip surface-mounting process using hybrid resin containing solder particles is proposed to shorten the underfill application process. The hybrid resin consists of semicured thermoset epoxy resin containing a reducing reagent, Sn–Bi solder particles, and thermoplastic polyester thin resin film. Viscosity and reduction ability of the hybrid resin were investigated via various techniques. The semicured epoxy resin fabricated at lower temperature showed better bondability. Acetic acid was effective in reducing the oxide film on the solder particles. The coalescence behavior of molten solder particles depended on both the reduction reaction and the viscosity of epoxy resin at the bonding temperature. The epoxy resin with low viscosity was mounted on the substrate via an overcoat of the polyester film. A conductive path covered with the resin formed between the chip resistor and the substrate via the hybrid resin.

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© 2013 The Japan Institute of Metals and Materials
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