MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
Diffusion Bonding of Cu–Cu with Al–Ni Nano Multilayers
Y. P. ZhangY. Q. YangJ. L. YiH. C. Hu
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2013 Volume 54 Issue 6 Pages 931-933

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Abstract

The paper examines the joinability, microstructures and thermal behaviors of the Al–Ni nano multilayers. The results reveal the transitions and possible compositions of the nano multilayers when heating. Nanoscale Al–Ni multilayers could be used in Cu–Cu diffusion joining though the process and preparation method need to be optimized.

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© 2013 The Japan Institute of Metals and Materials
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