Metal–Metal Bonding Process Using Cu+Ag Mixed Nanoparticles

抄録

The Cu+Ag mixed nanoparticles were prepared based on the chemical reduction method. The polymer coated on the Cu+Ag mixed nanoparticles can protect Cu nanoparticles from oxidation. The metal–metal joint of silver plated Cu bulks was investigated with the use of Cu+Ag mixed nanoparticles. The bonding experiments show that joint with shear strength about 20 MPa was formed at the bonding temperature above 250°C under 5 MPa using Cu+Ag mixed nanoparticles. The strength of bonding using Cu+Ag mixed nanoparticles is lower than that of bonding using pure Ag nanoparticles. This may be due to the fact that the sintering between the Cu nanoparticles and Ag nanoparticles is more difficult than the sintering between Ag nanoparticles.