Mechanism of Low Temperature Sintering-Bonding through In-Situ Formation of Silver Nanoparticles Using Silver Oxide Microparticles

Fengwen Mu; Zhenyu Zhao; Guisheng Zou; Hailin Bai; Aiping Wu; Lei Liu; Dongyue Zhang; Y. Norman Zhou

doi:10.2320/matertrans.MD201231

Mechanism of Low Temperature Sintering-Bonding through In-Situ Formation of Silver Nanoparticles Using Silver Oxide Microparticles

Fengwen Mu, Zhenyu Zhao, Guisheng Zou, Hailin Bai, Aiping Wu, Lei Liu, Dongyue Zhang, Y. Norman Zhou

Author information

Fengwen Mu
Department of Mechanical Engineering, Tsinghua University
Key Laboratory for Advanced Materials Processing Technology, Ministry of Education
Zhenyu Zhao
Department of Mechanical Engineering, Tsinghua University
Key Laboratory for Advanced Materials Processing Technology, Ministry of Education
Guisheng Zou
Department of Mechanical Engineering, Tsinghua University
Key Laboratory for Advanced Materials Processing Technology, Ministry of Education
Hailin Bai
Department of Mechanical Engineering, Tsinghua University
Key Laboratory for Advanced Materials Processing Technology, Ministry of Education
Aiping Wu
Department of Mechanical Engineering, Tsinghua University
Key Laboratory for Advanced Materials Processing Technology, Ministry of Education
Lei Liu
Department of Mechanical Engineering, Tsinghua University
Key Laboratory for Advanced Materials Processing Technology, Ministry of Education
Dongyue Zhang
Department of Mechanical Engineering, Tsinghua University
Key Laboratory for Advanced Materials Processing Technology, Ministry of Education
Y. Norman Zhou
Department of Mechanical Engineering, Tsinghua University
Key Laboratory for Advanced Materials Processing Technology, Ministry of Education
Department of Mechanical and Mechatronics Engineering, University of Waterloo

Keywords: silver oxide, sintering-bonding, in-situ formation, mechanism

JOURNAL FREE ACCESS

2013 Volume 54 Issue 6 Pages 872-878

DOI https://doi.org/10.2320/matertrans.MD201231

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Abstract

In this paper, a low temperature sintering-bonding process through in-situ formation of silver (Ag) nanoparticles using silver–oxide (Ag₂O) microparticles was studied. The Ag₂O powders were mixed with triethylene glycol (TEG) to form a paste, which was used to bond the Ag-coated copper (Cu) bulks. The results revealed that high temperature was helpful to increase the bond strength, and the joints average shear strength can reach 21.9 MPa at 523 K under 2 MPa for 5 min. And the mechanism of the reaction and sintering bonding process were basically made clear by using TGA-FTIR, FE-SEM and XRD, further, a reasonable sintering-bonding model was proposed.

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