MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678
Thermal Stress-Based Diffusion Bonding Method: the Case of Oxygen Free Copper to 316L Stainless Steel
Takashi HarumotoOsamu OhashiHiroki TsushimaMiho NaruiKensaku AiharaTakashi Ishiguro
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2015 Volume 56 Issue 10 Pages 1683-1687

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Abstract

Fixture composed of 304 stainless steel (SUS304) and 440C stainless steel (SUS440C) was employed for inducing the thermal stress to 316L stainless steel and oxygen free copper (SUS316L/OFC) cylinders to achieve diffusion bonding. For comparison, the same combination was bonded using the conventional diffusion bonding method, i.e. heating in vacuum under constant pressure. Although the thermal stress-based diffusion bonding is conducted in charcoal-reformed air, the bonding starts from 673 K. This temperature is relatively low as compared with the conventional method (873 K). Furthermore, the joint fabricated using the thermal stress-based method exhibits higher joint efficiency than one prepared using the conventional method. The highest tensile strength is attained at 1073 K and comparable to one of OFC. The bonding deformation of the thermal stress-based method is smaller than with the conventional method, since the fixture does not apply excess pressure to the diffusion couple. Thus the thermal stress-based diffusion bonding method is a promising and may be superior to the conventional method from view points of simplicity and bondability.

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© 2015 The Japan Institute of Metals and Materials
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