Effects of Cu Addition on the Microstructure and Localized Corrosion Resistance of Hyper Duplex Stainless Steels Aged at 748 K

Kyeong-Ho Kong; Soon-Hyeok Jeon; Soon-Tae Kim; Do-Hyang Kim; Byoung-Jin Kim; Hwan-Uk Guim; Moon-Byung Moon; Yong-Soo Park

doi:10.2320/matertrans.M2015022

Kyeong-Ho Kong, Soon-Hyeok Jeon, Soon-Tae Kim, Do-Hyang Kim, Byoung-Jin Kim, Hwan-Uk Guim, Moon-Byung Moon, Yong-Soo Park

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Keywords: copper, stainless steel, scanning electron microscope (SEM), transmission electron microscope (TEM), localized corrosion

JOURNAL FREE ACCESS

2015 Volume 56 Issue 5 Pages 749-754

DOI https://doi.org/10.2320/matertrans.M2015022

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Abstract

The effects of Cu addition on the microstructure and localized corrosion of hyper duplex stainless steels aged at 748 K were investigated using TEM analysis and electrochemical test. The addition of Cu to the base alloy facilitated the precipitation of a Cr-enriched α′-phase due to an increase in the Cr activity, thereby reducing the localized corrosion resistance. The localized corrosion was initiated at the Cr-depleted regions around the Cr-enriched α′-phase.

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