Abstract
The effects of reducing solvent on copper, nickel, and aluminum joining using silver nanoparticles derived from a silver oxide paste was investigated by thermal analysis, transmission electron microscopy (TEM) observation, and tensile shear testing. A complete weight loss of diethylene glycol (DEG) in a paste occurred during the redox reaction, whereas a polyethylene glycol 400 (PEG) paste retained the PEG solvent until about 300°C due to its longer carbon chains. Residual PEG in the paste reduced the natural oxide film on copper and nickel substrates during bonding, facilitating a direct sinter of silver nanoparticles to these substrates. On the other hand, silver nanoparticles were sintered to the natural oxide film on an aluminum substrate by the DEG paste. The suitability of the reducing solvent for oxide film reduction of the metal substrate during bonding was explained by an Ellingham diagram.
