Ag Nanowire and Nanoplate Composite Paste for Low Temperature Bonding

Abstract

Nanopastes based on noble metals for low temperature bonding are currently of great interest. We have developed Ag nanowire and nanoplate composite paste. Copper-copper joining has been achieved using solid state sintering of nanopastes. We show that an enhanced bonding strength can be achieved by integrating Ag nanoplates into Ag nanowire pastes. Ag nanowire and nanoplate composite pastes are capable of being a low-temperature interconnect material potentially for interconnection in lead-free microcircuits, flexible electronic packaging and sensing applications.