MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678
Effect of Trace Ge on Wettability and High-Temperature Oxidation Resistance of Sn-0.7Cu Lead-Free Solder
Qing-meng WangGui-sheng GanYunfei DuDonghua YangGuoqi MengHuaishan WangYi-ping Wu
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2016 Volume 57 Issue 10 Pages 1685-1690

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Abstract

Sn-0.7Cu and Sn-0.7Cu-xGe solder alloys were prepared to investigate the influence of trace Ge on liquid Sn-0.7Cu lead-free solder at high temperature. The spreadability and the wetting force of solders were tested, and the oxidation-resistance was also evaluated by eye observation and skimming at 250℃~370℃. The results have shown that trace Ge can improve the spreading rate of Sn-0.7Cu, but have a few effect on the wettability. The oxide slag quantity of Sn-0.7Cu was three times more than the Sn-0.7Cu-0.012Ge at the same temperature and period, the optimal content of Ge to improve the oxidation resistance of Sn-0.7Cu was 0.012 mass%. The growth factor of oxide film on the surface of liquid Sn-0.7Cu solder (k250℃ = 1.59 × 10−6, k370℃ = 3.03 × 10−6) were both twice higher than the Sn-0.7Cu-0.012Ge (k250℃ = 0.56 × 10−6, k370℃ = 1.04 × 10−6) at 250℃ and 370℃ respectively.

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© 2016 The Japan Institute of Metals and Materials
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