2017 Volume 58 Issue 2 Pages 148-151
Electro and electroless nickel platings have been extensively used as a diffusion barrier in under bump metallization (UBM) or as a surface finish on printed circuit boards (PCB). Even though a thin Ni layer on top of Cu can reduce the interfacial reactions with Sn-rich solders at a low reflow temperature, it may not be so effective when a reflow process is performed at a higher temperature and for a longer period. To provide a more robust diffusion barrier layer than electrodes Ni, electroless NiFe alloy system has been proposed. Since the electroless Ni-Fe plating bath has been rarely studied, the proper baths were not available commercially. In this research, the electroless plating of Ni-Fe alloys was investigated on the basis of complexing reagent. The stability of complexing reagent was studied. The compositions of electroplating layers were analyzed with EDS. The desired Ni-Fe alloy were obtained by controlling the chemical composition of the bath and its operating parameters.