MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
Comparison of Flip-Chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates: Part II. Flip-Chip Bonding on Compliant Substrates
Donghyun ParkKee-Sun HanTae Sung Oh
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2017 Volume 58 Issue 8 Pages 1217-1222

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Abstract

The contact resistance and microstructure of the flip-chip joints processed using anisotropic conductive adhesive (ACA) were characterized on flexible printed-circuit-board (FPCB) and stretchable FPCB/polydimethylsiloxane (FPCB/PDMS) substrates. On the FPCB substrate, the contact resistance was remarkably reduced from 56.9 mΩ to 13.3 mΩ when the bonding pressure increased from 10 MPa to 200 MPa. However, at a bonding pressure of 300 MPa, it substantially increased to 74.8 mΩ with an excessive deviation of ±37.7 mΩ. On the more compliant FPCB/PDMS substrate, the contact resistance decreased from 43.2 mΩ to 31.2 mΩ when the bonding pressure increased from 10 MPa to 50 MPa. Severe distortion of the FPCB/PDMS substrate occurred at bonding pressures above 50 MPa because of the softness of the PDMS. A more compliant substrate has a lower appropriate bonding pressure for the flip-chip process.

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© 2017 The Japan Institute of Metals and Materials
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