MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678
Effect of Thermal Cycles on Microstructure of Er2O3 Thin Film on SUS316 Substrate with Y2O3 Buffer Layer Fabricated by MOCVD Method
Masaki TanakaSeungwon LeeKenji MatsudaYoshimitsu HishinumaKatsuhiko NishimuraTeruya TanakaTakeo Muroga
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2018 Volume 59 Issue 2 Pages 176-181

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Abstract

Erbium oxide (Er2O3) and Yttrium oxide (Y2O3) are the promising materials to realize an advanced breeding blanket system because of good electrical resistivity and effective hydrogen permeation suppression. In this report, Er2O3 thin film fabricated via MOCVD process with the Y2O3 layer formed on SUS316 substrate before and after thermal cycles to investigate the effect of thermal cycling. Their microstructure was confirmed by SEM, AFM, TEM and STEM. The surface morphology of samples after thermal cycling has small granular structure than samples before thermal cycling and without buffer layer. According to cross sectional observation by TEM and STEM, Er2O3 and Y2O3 have different columnar structure, while buffer layer did not avoid diffusing elements from SUS316 substrate to Er2O3 layer. The thermal cycling test had not been affected to the growth direction of Er2O3 and Y2O3 layers, which is mostly cube-cube relationship.

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© 2017 The Japan Institute of Metals and Materials
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