MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678
Preparation of Copper-Based Superhydrophobic Surfaces by Jet-Electrodeposition
Chen JinsongGuo JianQiu MingboYang JianmingHuang DazhiWang XiaoliDing Yunfei
Author information
JOURNAL FREE ACCESS FULL-TEXT HTML

2018 Volume 59 Issue 5 Pages 793-798

Details
Abstract

The surface state of metallic materials significantly affect their physical, chemical, and corrosion behavior. In the present study, superhydrophobic coating with copper deposits fabricated using a jet-electrodeposition device on the pure copper substrates for reducing the corrosion rate of the copper substrates was studied. The effect of the micro-nano structured superhydrophobic coating on the improvement of corrosion resistance was investigated. Factors including the microstructures and wetting properties of coating were comprehensively analyzed using a scanning electron microscope, a Fourier transformed infrared and a surface contact angle meter. Results showed that the superhydrophobic coatings demonstrated a micro-nanostructure on the copper substrates. After modifying the copper deposits with stearic acid, a superhydrophobic surface was consequently obtained. The static contact angle (CA) and the sliding angle of the copper-based superhydrophobic surface were 151.6° and 5.7°, respectively. The samples covered with superhydrophobic coating exhibited relatively higher corrosion potential and lower corrosion current than the bared pure copper samples, indicating a notable enhancement of corrosion resistance characterized using polarization tests by an electrochemical workstation.

Content from these authors
© 2018 The Japan Institute of Metals and Materials
Previous article Next article
feedback
Top