Abstract
In the present study, self-assembled submicrometer-sized composite structure of bismuth-antimony (Bi–Sb) alloy and indium antimonide (InSb) were fabricated by melt-spinning (MS) technique and spark plasma sintered (SPS) process with the eutectic composition. The power factor reached 2.6 mW/mK2 at 300 K. The thermal conductivity decreased by 35% compared with the Bi–Sb alloy. The results suggest that this MS-SPS procedure is promising for reducing the thermal conductivity with maintaining the electrical properties.
Fig. 6 The temperature dependences of thermal conductivities, (a) total thermal conductivity, (b) electronic thermal conductivity, and (c) lattice thermal conductivity.
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