MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678
Effect of Bi Addition on Tensile Properties of Sn–Ag–Cu Solder at Low Temperature
Yukihiko HiraiKouki OomoriHayato MorofushiIkuo Shohji
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2019 Volume 60 Issue 6 Pages 909-914

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Abstract

In order to examine the effect of the Bi addition on tensile properties of Sn–Ag–Cu solder at low temperatures, stress-strain diagrams were acquired by tensile tests at 233 K using miniature size specimens. Stress drops were observed in the stress-strain diagram of Sn–Ag–Cu–Bi solder before it lead to a break. Similar phenomenon did not observed in the Sn–Ag–Cu solder. The stress drops was exceptionally sharp in the Sn–Ag–Cu solder with added 3 mass% Bi, compared to the solder with added 1 or 2 mass% Bi. The mode of the stress drop is depended on twin deformation. On the contrary, similar stress drop phenomenon was not observed in any stress-strain diagrams at 298 K. From the results of grain map analysis, it was found that many twin deformations occur in the specimen in which exceptional sharp stress drops appear in the stress-strain diagram.

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© 2019 The Japan Institute of Metals and Materials
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