PREFACE
2019 Volume 60 Issue 6 Pages 849
Details
2019 Volume 60 Issue 6 Pages 849
Researches of interconnect materials for electronics packaging that were actively conducted in 1990’s with a main focus on developing lead-free solders are now rekindled due to a growing demand for development of electronics systems for self-driving and electric vehicles. In the field of electric vehicles, it is necessary to develop high temperature resistant interconnect materials such as high temperature solder alloys as a die attach material for power semiconductor devices and sintering bonding technology with the use of metal nanoparticles. In autonomous driving technology of vehicles, of which development and promotion are now underway, high reliability packaging technology for automotive sensors capable of withstanding a long-time use is now required. For power semiconductor devices and future sophisticated automotive electronics systems, in addition to developing a new packaging material, reliable test data of the newly developed material such as fatigue and creep are required and it is desired that method for long-term life predictions through computer simulations using the test data is established. In the automotive electronics that demand high temperature resistance and long-term reliability, investigations that have been conducted so far on interconnect technologies for consumer electronics products are not sufficient. In fact, it is indispensable to conduct highly sophisticated investigations by taking a more theoretical or scientific approach than ever. In the consumer products, there is a demand for low temperature bonding technology to reduce the effects on environment and it is expected that packaging technologies using low-melting point solder alloys and conductive adhesives are established. However, mechanical and thermal reliability of interconnect materials to be used for low-melting point solder alloys and conductive adhesives is less well understood or yet to be understood, under which circumstance, low temperature packaging is rarely used. While there are many research problems around interconnect materials for electronics packaging, the domestic academia is not much interested in the field of electronics packaging. It is expected that more researchers participate in this field.
The following research articles are introduced in this special issue: Mechanical properties of Lead-free solders and sintered Ag-nanoparticles, development of resin materials, physico-chemical phenomena of joint interfaces, and theoretical simulation regarding plastic deformations of interconnect material. We hoped that this special issue will help develop future sophisticated electronics packaging technology.
