2020 Volume 61 Issue 4 Pages 663-667
The effects of Co and P on the discontinuous precipitation (DP) behavior of Cu–Ni–Si system alloys have been investigated using Cu–4.5 mass%Ni–1.1 mass%Si alloy (base alloy), Cu–4.0 mass%Ni–0.5 mass%Co–1.1 mass%Si alloy (Co alloy) and Cu–4.0 mass%Ni–0.5 mass%Co–1.1 mass%Si–0.05 mass%P alloy (Co + P alloy) aged at 430, 460 and 490°C. In all the alloys, slightly before attaining peak age-hardening within grains, DP cells nucleated at grain boundaries and grew into the grains ahead of reaction fronts. The growth rates of DP cell for Co alloy were slower than those for Base one. Moreover, the trace addition of P to Co alloy (Co + P alloy) considerably retarded DP reaction. The kinetic analyses of DP using the Turnbull (T) and Petermann and Hornbogen (P-H) models yielded grain-boundary diffusion data. The activation energies for the base and Co alloys obtained using the T model were nearly identical and 125 and 124 kJ mol−1, respectively. The values for both alloys determined from the P-H model were slightly larger than those obtained from the T model and about 130 kJ mol−1. These results strongly suggested that the growth of DP cells in base and Co alloys was controlled by the boundary diffusion of Ni, and Ni or Co in Cu matrix, respectively. The smaller growth rate of DP cells in the Co alloy was ascribed to the higher number density of continuous δ precipitates than that of base one, which successively suppressed the boundary migration.
This Paper was Originally Published in Japanese in Journal of the Japan Institute of Copper 57 (2018) 101–106.
Fig. 2 Optical micrographs of (a) Base, (b) Co and (c) Co + P alloys aged at 460°C for 3 h.
Copper alloys used for electronic components are required to have high strength, good electrical conductivity and appropriate bend formability to achieve miniaturization and improve the functionality of electronic equipment. Alloys based on the Cu–Ni–Si system, widely known as Corson alloys, have an excellent balance between strength and electrical conductivity. Thus, Corson alloys are used in a wide range of electrical applications. The electrical conductivity of Corson alloys is generally higher than that of Cu–Be and Cu–Ti system alloys, but the strength of Corson alloys is relatively low compared with Cu–Be and Cu–Ti system alloys. Therefore, improvements in the strength of Corson alloys are increasingly essential to attain high-density packaging in electronic devices.
It is well known that the high strength of Corson alloys is caused by the precipitation of a fine δ-Ni2Si phase. Era et al.1) and Kuwagaki et al.2) have reported that age-hardening in Corson alloys increases with increasing Ni and Si concentration. However, higher amounts of Ni and Si lead to discontinuous precipitation (DP) at the grain boundaries.3) Fine δ-precipitates with sizes of several nanometers formed by continuous precipitation (CP) significantly contribute to age-hardening. Conversely, DP causes the mechanical properties of the alloys to deteriorate because the DP reaction produces coarse rod-shaped precipitates in the DP cells.3) Watanabe et al. reported that the addition of trace P to a Cu–Ni–Si alloy significantly suppressed the DP reaction.3) Recently, Izawa et al.4) showed that the partial replacement of Ni with Co in a Cu–Ni–Si system alloy resulted in an increase in the volume fraction of fine δ-precipitates and thus led to an increase in the strength of the alloy. However, the influence of Co on the DP reaction in Cu–Ni–Si alloys has not yet been clarified. In this study, using high-concentration Cu–Ni–Si system alloys, the effects of Co and P on the DP behavior of the alloys were systematically investigated.
Ingots of Cu–4.5 mass%Ni–1.1 mass%Si (base), Cu–4.0 mass%Ni–0.5 mass%Co–1.1 mass%Si (Co) and Cu–4.0 mass%Ni–0.5 mass%Co–0.05 mass%P (Co + P) alloys were prepared by melting. The atomic Ni/Si ratio or the (Ni + Co)/Si ratio was set to be equivalent to the stoichiometric atomic ratio of the δ-Ni2Si phase, i.e., 2:1. The ingots were homogenized at 950°C for 3 h and then hot-rolled. Cold-rolling and annealing were repeatedly conducted to attain a thickness of 2 mm. The rolled sheets of the alloys were solution treated at 1000°C for 2 h and subsequently quenched into cold water. Aging treatments were then performed at 430, 460 and 490°C in vacuum.
The microhardness and resistivity of the specimens were measured before and after aging. For the microhardness measurements, the samples were first polished with SiC paper and then measured using a Vickers hardness tester. The electrical resistivity was measured using the four-terminal method at 20°C using a DC resistance meter (Hioki Electric RM 3545).
Microstructural observations were performed using optical microscopy, scanning electron microscopy (SEM) and transmission electron microscopy (TEM). For TEM observations, thin foils were prepared by electropolishing using a twin-jet type electro polisher. TEM observations were performed using a JOEL 2010FEF microscope (operated at 200 kV) equipped with an energy dispersive X-ray spectroscopy (EDX) system for chemical composition analysis of the precipitates.
Figure 1 shows the age-hardening curves of the base, Co and Co + P alloys during aging at 460°C. The closed and open symbols represent the hardness obtained from in-grains (CP) and DP cells (DP), respectively. For all the alloys, the maximum hardness was achieved after approximately 3 h. The Co and Co + P alloys exhibited a more rapid initial hardening and higher peak hardness compared with those of the base alloy. The higher peak hardnesses of the Co and Co + P alloys can be ascribed to the higher number density of CP precipitates, as will be discussed in Section 3.3. The DP reaction initiated in each alloy just before peak hardness was attained. It can be seen that the hardness of the DP cells is lower than that within the grains. These results are in good agreement with the literature.3,4)
Age-hardening curves of Base, Co and Co + P alloys aged at 460°C. The closed symbols and open symbols indicate microhardness of in-grains (CP) and DP cells, respectively.
Figure 2 shows optical micrographs of the base, Co and Co + P alloys after aging for 3 h at 460°C. The formation and growth of DP cells (regions with dark contrast) can be seen in all alloys. The DP cells initially formed at grain boundaries and grew toward the adjacent grains with increasing aging time. The reaction fronts only migrated in one direction. The area fraction of DP cells decreased in the order of base, Co and Co + P alloys, as can be seen in Fig. 2. The changes in the area fraction of DP cells upon aging at different temperatures are summarized in Fig. 3. The area fraction of DP cells increased with increasing aging time t, and then saturated. Higher aging temperatures brought about a higher increase in the area fraction.
Optical micrographs of (a) Base, (b) Co and (c) Co + P alloys aged at 460°C for 3 h.
Change in the area fraction of DP cells against aging time during aging of Base, Co and Co + P alloys at 430 and 490°C.
Figure 4 illustrates the cell width w as a function of t for the base, Co and Co + P alloys aged at 430 and 490°C. It can be seen that linear relationships exist between w and t for all alloys and aging temperatures. A decrease in cell growth rates after a certain aging time can be seen for base and Co alloys upon aging at 490°C. It can also be seen that partial replacement of Ni with Co in the base alloy decreased the cell growth rate. Moreover, the addition of trace P to the Co alloy significantly suppressed DP cell growth.
Change in the cell width w against aging time during aging of Base, Co and Co + P alloys at 430 and 490°C.
Kinetic analyses of DP cell growth were performed using the Turnbull (T) and Petermann and Hornbogen (P–H) models. Although both of these models were originally developed for binary system alloys, they can be applied to the present alloys under the assumption of a Cu–δ quasi-binary system. According to these models, the growth kinetics can be expressed by5,6)
\begin{equation} s\delta D_{\text{b}} = \frac{x_{0}}{x_{0} - x_{e}}v\lambda^{2}\ (\text{T}) \end{equation} | (1) |
\begin{equation} s\delta D_{\text{b}} = -\frac{RT}{8\Delta G}v\lambda^{2}\ (\text{P-H}), \end{equation} | (2) |
\begin{equation} \Delta G = -RT\left[x_{0}\ln\frac{x_{0}}{x_{\text{e}}} + (1 - x_{0})\ln\frac{1 - x_{0}}{1 - x_{\text{e}}}\right] + \frac{2\sigma V_{\text{m}}}{\lambda}. \end{equation} | (3) |
From the slopes of the linear fits shown in Fig. 4, which were computed using the least-squares method, the cell growth rate v was obtained for each aging temperature and alloy. The obtained values of v are listed in Table 1. The values of λ were determined by SEM and TEM. Rod-shaped coarse δ precipitates were observed within the DP cell, as previously reported.3) The rod-shaped δ precipitates maintained an almost constant value of λ under isothermal growth conditions. Table 2 summarizes the obtained values of λ. The values of λ in the Co alloy were smaller than those in the base alloy for each aging condition.
The solvus xe was obtained experimentally according to the coarsening theory modified by Ardell,10) under the assumption of a Cu–δ quasi-binary system. The concentration of solute in the matrix x(t) after coarsening time t is expressed as
\begin{equation} x(t) - x_{e} = kt^{-1/3}, \end{equation} | (4) |
Change in the solute concentration in the Cu matrix during aging of Base and Co alloys at 430°C.
Results of EDX analysis obtained from δ precipitates in Co alloys solution treated at 1000°C for 2 h and then aged at 430, 460 and 490°C.
As can be seen in Fig. 5, the solute concentration rapidly decreased at the beginning of the aging period, and then linear relationships between solute concentration and t−1/3 were obtained after a certain aging time, as would be expected from eq. (4). The rapid decrease in solute concentration and the linear relation correspond to the nucleation and growth stage, and the coarsening stage of the δ precipitates,10) respectively. The values of xe were evaluated directly by extrapolation to t−1/3 = 0 (t → ∞) using the least-squares method and are listed in Table 3. The values of xe for the Co alloy are smaller than those for the base alloy at each aging temperature. These results agree well with previous investigations.4)
The sδDb values at each aging temperature for the base and Co alloys were calculated from eqs. (1), (2), and (3) using experimentally obtained values of xe, λ, and ν. Figure 7 presents the Arrhenius plots of the sets of sδDb data derived using the T and P-H models. For all temperatures, the values of sδDb for the base alloy are larger than those for the Co alloy. Although only three sets of data points for each alloy were available, the activation energy Qb of grain-boundary diffusion was determined from the slope of the straight lines fitted to each sδDb dataset. The values of Qb for the base alloy were 125 ± 1 and 130 ± 2 kJ mol−1 using the T and P-H models, respectively, and the corresponding values for the Co alloy were 124 ± 1 and 133 ± 11 kJ mol−1. The values calculated using the P-H model are slightly larger, but no significant differences were found between the alloys. It is well known that the activation energy of grain boundary diffusion is about one half to two thirds of the activation energy of impurity diffusion (Qv, Ni = 225 kJ mol−1,13) Qv, Co = 214 kJ mol−1 14) and Qv, Si = 172 kJ mol−1 13)). The Qb values obtained from the T and P-H models are considerably smaller than Qv, Si, and about half those of Qv, Ni and Qv, Co. This strongly suggests that the DP cell growth is controlled by grain boundary diffusion of Ni in the base alloy and Ni and/or Co in the Co alloy. The values of Qb are nearly identical for both alloys, although it should be noted that there exists a difference in the DP cell growth rates (Fig. 4).
Arrhenius plots of the sδDb values obtained using the models of Turnbull (T) and Petermann-Hornbogen (P-H) for Base and Co alloys.
It is well known that the existence of fine precipitates within grains affects the growth behavior of DP cells. The causes of this effect are a lowering of the degree of supersaturation of the solute by the CP reaction, which reduces the driving force of DP cell growth, and also pinning effects due to the movement of advanced grain boundaries (reaction fronts) by finely dispersed CP precipitates.15,16) It can be seen from Fig. 1 that the CP behavior is different between the base and Co alloys. Compared with the base alloy, the hardness of the Co alloy increased more rapidly in the early stages of aging and the attained peak hardness of the alloy was higher. To quantitatively discuss the difference in CP behavior between the base and Co alloys, the size and number density of CP precipitates before the formation of DP cells occurred were investigated. Figure 8 shows a representative high-resolution TEM image of the Co alloy aged at 430°C for 1 h. The incident direction of the electron beam was parallel to the [100]α plane. Disk-shaped fine precipitates with a habit plane parallel to the {110}α planes of the Cu matrix were visible. From the analyses of selected area diffraction patterns, these fine precipitates were determined to be the δ phase. The following orientation relationship was found between the Cu matrix and the δ precipitate:
\begin{equation*} [100]_{\alpha}\mathrel{/\!/}[001]_{\delta};(011)_{\alpha}\mathrel{/\!/}(010)_{\delta}. \end{equation*} |
HRTEM image of Co alloy aged at 430°C for 1 h.
The effects of Co and P on discontinuous precipitation (DP) behavior in Cu–Ni–Si alloys were investigated using Cu–4.5 mass%Ni–1.1 mass%Si alloy (base), Cu–4.0 mass%N–0.5 mass%Co–1.1 mass%Si alloy (Co), and Cu–4.0 mass%Ni–0.5 mass%Co–1.1 mass%Si–0.05 mass%P (Co + P) alloys. The findings of the investigation can be summarized as follows: