2022 Volume 63 Issue 6 Pages 759-765
A method for predicting the lifetime of fatigue crack network formation in die-attach joints is considered through experiments on high-speed thermal cycling using a Si/solder/Si joint specimen and the mechanism is identified. Equibiaxial stresses are generated in the solder layer because thermal deformation of the solder is constrained by the Si, which causes continuous initiation and propagation of crisscross-shaped cracks. When the crack density is sufficiently high, crack growth is arrested by collisions between cracks, and the formation of the fatigue crack network is completed. Based on these results, development of the damaged area and arrest of the development by collisions between the cracks is expressed in terms of extended volume theory incorporating crack initiation and propagation functions for solder as well as considering the damage rate equation. The experimental result for the relationship between the damage ratio in the die-attach joint and the number of cycles under each thermal condition are reproduced by the damage rate equation.
The die-attach materials used to connect a power semiconductor die to an insulating substrate can fracture due to fatigue resulting from cyclic thermal stresses or thermal strains generated during device operation (power cycle), leading to device failures that increase with thermal resistance. It has been reported that when Sn-based lead-free solder alloys are used for the die-attach materials, the fatigue cracks connect to each other, forming networks (hereafter, thermal fatigue crack networks).1) Recently, this type of fracture has become a leading fracture mode in die-attach joints in power devices, generating research interest into the fracture mechanisms and methods of life prediction. The authors have previously conducted high-speed thermal cycling tests simulating power cycling using a Si/Solder/Si joint specimen and clarified that equibiaxial tensile and compressive deformation in the die attach joint in the direction parallel to the joint surface causes cracks to occur and propagate in the high Σ grain boundaries generated by continuous recrystallization, resulting in crack network formation.1,2) However, life prediction methods for this type of fatigue fracture have not yet been established. The fatigue crack network is formed by the sequential initiation and subsequent propagation of micro-cracks from multiple sites. Therefore, in the lifetime prediction method, it is necessary to consider the initiation and growth of cracks and the arrest of crack propagation via the interconnection of cracks. Thus, high-speed thermal cycling testing was conducted on the same Si/Solder/Si joint specimen as previously reported and the process of fatigue crack network development was closely examined based on the relationship between the number of cracks, crack lengths, and the number of cycles. The damage rate equation corresponding to the mechanisms of fatigue crack network formation was then studied based on the investigated mechanisms of fatigue crack network formation.
The die-attach material was a solder alloy of composition Sn–3.0 mass%Ag–0.5 mass%Cu. As previously reported, the specimen was a Si/Solder/Si joint made by bonding two 10 mm × 10 mm × 0.625 mm Si chips together using 300 µm thick preformed solder.2) Figure 1 shows the geometry of the specimen.
Geometry of Si/Solder/Si joint specimen.2)
High-speed thermal cycling testing was conducted on the Si/Solder/Si joint specimen in three temperature ranges, as shown in Table 1. Figure 2 shows a schematic illustration of the test equipment. The details of the test method have been published previously.2) After the given number of thermal cycles was applied, the test was suspended, and X-ray transmission images were scanned by micro-focus X-ray CT (U.H.SYSTEM:Si-300, the focal spot size is 4 µm) to observe for crack initiation and propagation.
Schematic illustration of high-speed thermal cycle test.2)
Figure 3 shows X-ray transmission images of the solder layer after the specified number of cycles under each test condition. The white parts in the images correspond to cracks. Images of different specimens were observed. As the cycling progressed, the number of cracks increased, and cracks propagated and connected with each other to form crack networks. At higher temperatures, cracks emerged after fewer cycles and the fatigue crack networks formed in shorter periods. These X-ray transmission images were used to investigate the relationship between the number of cracks, crack length, and number of cycles. The number of cracks and crack length were measured with image processing software (ImageJ).
X-ray transmission images of specimens subjected to high-speed thermal cycling.
To predict the life of fatigue crack networks, a damage rate equation based on fracture mechanisms is required. Therefore, the mechanism of fatigue crack network formation that was clarified in our previous report2) is described here again.
Figure 4 shows the contours of axial stresses in the x and y directions parallel to the solder joint surface during the high-speed thermal cycling test, which was obtained by FEM analysis. As the temperature increased, the solder layer was put into a biaxial compressive stress state in the direction parallel to the joint surface, while the solder layer was put into a biaxial tensile stress state as the temperature decreased. Figure 5 shows the stress-creep strain hysteresis loops in the x, y, z, and xy (shear) directions at the center of the solder layer. The biaxial stresses in the x and y directions were dominant and the hysteresis loops coincided with each other. Stress did not occur in the z direction and both stress and strain in the shear direction were nearly zero. Thus, equibiaxial tensile-compressive deformation occurred over the entire area of the solder layer during the thermal cycling. Because the specimen used in the study had a structure in which the solder was sandwiched between silicon plates, there are no differences in the thermal expansion coefficients between the top and the bottom layers, and no shear deformation occurs. However, because thermal expansion in the solder layer was constrained by the Si, the solder layer was in a biaxial compressive stress state in the direction parallel to the joint surface as the temperature increased, resulting in stress leading to compressive deformation. As the temperature decreased, the solder layer contracted and deformed in the direction of the compressive deformation when the temperature increased to return to the previous state, and the solder layer was in a biaxial tensile stress state and deformed under tension in the direction parallel to the joint surface. Figure 6 shows fatigue crack networks reproduced by FEM analysis. Tensile deformation occurred as the temperature dropped, opening cross-shaped cracks in the area where equibiaxial stresses were generated and cracks propagated in the crisscross direction, thereby expanding the damaged area. Concurrent with the propagation of existing cracks, new cracks also initiated in the undamaged areas, and all these cracks became interconnected and further propagated, ultimately forming a fatigue crack network. During the fatigue crack network development process, crack connections and decreased strain energy density near the cracks caused the saturation of the fatigue crack network development. To consider the fracture life of fatigue crack networks, it is necessary to incorporate crack initiation, propagation, and saturation of damage by crack interconnection in the area where equibiaxial stresses occur. Therefore, crack initiation and propagation behaviors were closely examined as factors that dominate the damage rate and an equation for damage rate was studied based on the mechanisms of the fatigue crack network formation.
Contours of axial stresses in the x and y (parallel to Si face) directions of the solder layer.2)
Hysteresis loops of the creep strain-stress at the center of the solder layer.2)
Creep strain energy density contours showing crack initiation and propagation at the minimum temperature of high-speed thermal cycling.2)
The crack initiation rate was calculated from the relationship between the number of cracks and the number of cycles observed from the x-ray transmission images. Figure 7 shows the relationship between the number of cracks and the number of cycles under each test condition obtained from the x-ray transmission images. In each test condition, the number of cracks increased progressively and became saturated at a certain number of cycles. In the fatigue crack network fracture, an initial crack emerged after some incubation period and then the number of crack initiations increased. When the number of cracks became sufficient, the strain energy density near the cracks decreased, leading to a decrease in the number of crack initiations and eventually resulting in saturation of the number of cracks. Thus, the relationship between the number of cracks and the number of cycles became sigmoidal (S-shaped). Because the crack initiation rate depends on the inelastic strain energy density range, the strain energy density range that caused fractures increased and the crack initiation rate increased at higher temperatures.
Relationships between the number of cracks and number of cycles during high-speed thermal cycling.
The behaviors of the S-shaped curve were quantified by using the logistic model3) described in eq. (1). Functionalizing the rate of crack initiation was explored by investigating the dependence of each constant of the logistic model on the driving force of crack initiation.
\begin{equation} y = \frac{M}{1 + \exp (- aN - b)} \end{equation} | (1) |
\begin{equation} \frac{dy}{dN} = \frac{ay(M - y)}{M} \end{equation} | (2) |
Logistic curves for the crack initiation rate during high-speed thermal cycling.
The constants a, b, and M in eq. (1) and eq. (2) have the following qualities. The value of the crack initiation frequency constant a is related to the crack initiation rate. As a becomes smaller, the logistic curve becomes more gradual and the angle of the curve until the number of cracks becomes the maximum decreases. The value of b is found from aN + b = 0, that is, when N = −b/a, it represents the cycle with the maximum rate of crack initiation. When the driving force of crack initiation caused by the equibiaxial stress is large, the cycle with the maximum crack initiation rate becomes short. Therefore, −b/a depends on the driving force of crack initiation. Furthermore, it can be predicted from the logistic approximation in Fig. 7 that the maximum number of cracks M also depends on the driving force of crack initiation. Therefore, FEM was used to analyze how the constants a, −b/a, and M in the area where equibiaxial tensile-compressive deformation occurs depend on the driving force of crack initiation. The inelastic strain energy density range ΔWin was employed as the driving force of crack initiation.
First a and M were considered. In the testing of corrosion fatigue in metals where numerous cracks occur randomly, the relationship between the number of cracks and the number of cycles is expressed by an S-shaped function similar to the one in the present study. It has been reported that the crack initiation frequency factor and the maximum number of cracks form a relationship that is semi-logarithmic in terms of stress amplitude.4) Therefore, the crack initiation frequency factor of the logistic curve a and the maximum number of cracks M were also allowed to take a semi-logarithmic relationship with ΔWin and the relationships found between each constant and ΔWin are indicated by eq. (3) and eq. (4) respectively.
\begin{equation} a = 7.00 \times 10^{-4}\exp\ (5.29\Delta W_{\text{in}}) \end{equation} | (3) |
\begin{equation} M = 24.4\exp\ (8.84\Delta W_{\text{in}}) \end{equation} | (4) |
Next −b/a was considered. When low cycle fatigue fractures in a metal are dominated by the inelastic strain energy density range, Morrow’s power law between ΔWin and the fatigue life Nf holds.5) Because multiple cracks occur on the surface of a smooth test specimen during high temperature fatigue, the lifetime given by Morrow’s law is interpreted as the number of cycles until the maximum crack initiation rate. In the fatigue crack network fracture, because multiple cracks occur in the damaged area, the cycle b/a when the crack initiation rate becomes the maximum is assumed to be equivalent to the lifetime given by Morrow’s law. Thus, the constant of Morrow’s law was determined to be eq. (5) from −b/a and ΔWin at each level obtained from the logistic curve.
\begin{equation} \Delta W_{\text{in}} \cdot \left(- \frac{b}{a} \right)^{1.0}{} = 623 \end{equation} | (5) |
It was assumed that ΔWin around a fatigue crack tip represents the mechanical environment of the fracture propagation area, based on which ΔWin was used as the driving force of crack propagation. As described previously, cracks propagate by the opening of crisscross-shaped micro cracks caused by equibiaxial tensile deformation, which occurs as the temperature decreases. Therefore, the FEM model in Fig. 9 having a crisscross-shaped crack inserted in the die attach center of the joint specimen was used for calculation of ΔWin. An area of 60 µm2 around the crack tip was divided into 10 µm square elements and ΔWin was calculated as the volume average of each element.6,7)
\begin{equation} \Delta W_{\text{in}} = \frac{\displaystyle\sum \Delta W_{\text{in}}^{\text{element}} \times V^{\text{element}}}{\displaystyle\sum V^{\text{element}}} \end{equation} | (6) |
\begin{equation} \dot{\varepsilon}_{\text{ss}} = 1.26 \times 10^{-8}\sigma^{8.77}\exp \left(\frac{-60\,\text{kJ/mol}}{RT} \right) \end{equation} | (7) |
\begin{equation} \frac{da}{dN} = A_{1}\Delta W_{\text{in}}^{A_{2}} \end{equation} | (8) |
FEM model for calculation of ΔWin (1/4 symmetry).
Hereafter, derivation of a damage rate equation based on the mechanism of fatigue crack network formation is considered. Based on the fatigue crack network formation mechanism, it is assumed that fatigue damage develops based on the mechanisms 1) to 3) below. A schematic illustration for defining damage in the fatigue crack network is shown in Fig. 10.
Schematic illustration defining damage area due to crisscross-shaped crack.
The damage ratio in the case where the damaged areas extended with no consideration given to collisions between damaged areas is described by eq. (9), which is defined as the extended damage ratio Se.
\begin{equation} S_{e} = \sum_{i}S_{i} \end{equation} | (9) |
\begin{equation} U = \prod_{i}(1 - S_{i}) \end{equation} | (10) |
\begin{equation} \ln U = \ln \prod_{i}(1 - S_{i}) = \sum_{i}\ln (1 - S_{i}) \end{equation} | (11) |
\begin{equation} \ln (1 - S_{i}) = - S_{i} \end{equation} | (12) |
\begin{equation} \ln U = \sum_{i} - S_{i} = - S_{e} \end{equation} | (13) |
\begin{equation} \ln U = \ln (1 - S) = - S_{e} \end{equation} | (14) |
\begin{equation} S = 1 - \exp (- S_{e}) \end{equation} | (15) |
The specific equation of extended damage ratio Se is also discussed. Because the damaged area is formed by the propagation of fatigue cracks in a crisscross-shape, when the half-length of a crack is assumed to be a as in Fig. 10 and the crack propagation rate da/dN is used, then the damaged area s formed by the crack propagation from the incubation cycle number Ni to a given cycle number N is obtained by eq. (16).
\begin{equation} s = (2a)^{2} = 4\left(\frac{da}{dN} \right)^{2}(N - N_{i})^{2} \end{equation} | (16) |
\begin{equation} S_{e} = \int_{N_{i}}^{N}Y(N_{i})4 \left(\frac{da}{dN} \right)^{2}(N - N_{i})^{2}dN_{i} \end{equation} | (17) |
\begin{equation} S_{e} = \frac{4}{3}Y\left(\frac{da}{dN} \right)^{2}N^{3} \end{equation} | (18) |
\begin{equation} S = 1 - \exp \left\{-\frac{4}{3}Y\left(\frac{da}{dN} \right)^{2}N^{3} \right\} \end{equation} | (19) |
The relationship between the damage rate based on the fatigue crack network formation and the number of cycles was found by using the derived damage rate equation eq. (19). Figure 11 shows the relationships between the damage ratios under each test condition and the number of cycles obtained by eq. (19) and comparison of experimentally obtained damage ratios for the number of respective cycles. Because the fatigue crack propagation law of Sn–3.0Ag–0.5Cu derived using ΔWin is not available, the fatigue crack propagation law constant was chosen such that eq. (19) best reproduces the experimental values. Equation (20) shows the fatigue crack propagation law determined by the method.
\begin{equation} \frac{da}{dN} = 0.075\Delta W_{\text{in}}^{1.2} \end{equation} | (20) |
Relationships between damage ratio and number of cycles.
Relationships between crack propagation rate and ΔWin for Sn–3.0Ag–0.5Cu and Sn–5.0Sb.