抄録
An accumulative roll bonding process was applied up to 8 cycles on high-purity aluminum, aluminum–0.02 mass%iron and aluminum–0.2 mass%iron in order to measure electrical properties in addition to the mechanical properties. Ultimate tensile strength increases about 3–5 times compared with that of coarse grain metals, whereas, the electrical conductivity at room temperature decreases about a few %IACS. The dislocation density and density of grain boundary were evaluated from XRD and SEM/EBSD measurements. The microstructure change in those parameters explains the change in electrical resistivity measured at 77 K.
Fig. 3 (a) Electrical conductivity (IACS%) and (b) electrical resistivity at 77 K of ARB processed high-purity aluminum, Al–0.02Fe and Al–0.2Fe depending on the ARB cycle number.
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