Deformation Behavior of Pure Cu and Cu-Ni-Si Alloy Evaluated by Micro-Tensile Testing

Sari Yanagida; Akiyoshi Araki; Tso-Fu Mark Chang; Chun-Yi Chen; Takashi Nagoshi; Equo Kobayashi; Hideki Hosoda; Tatsuo Sato; Masato Sone

doi:10.2320/matertrans.M2016188

This article has now been updated. Please use the final version.

Deformation Behavior of Pure Cu and Cu-Ni-Si Alloy Evaluated by Micro-Tensile Testing

Sari Yanagida, Akiyoshi Araki, Tso-Fu Mark Chang, Chun-Yi Chen, Takashi Nagoshi, Equo Kobayashi, Hideki Hosoda, Tatsuo Sato, Masato Sone

Author information

Sari Yanagida
Laboratory for Materials and Structures, Tokyo Institute of Technology
Laboratory for Future Interdisciplinary Research of Science and Technology, Tokyo Institute of Technology
CREST, Japan Science and Technology Agency
Akiyoshi Araki
Department of Materials Science and Engineering, Tokyo Institute of Technology
Tso-Fu Mark Chang
Laboratory for Materials and Structures, Tokyo Institute of Technology
Laboratory for Future Interdisciplinary Research of Science and Technology, Tokyo Institute of Technology
CREST, Japan Science and Technology Agency
Chun-Yi Chen
Laboratory for Materials and Structures, Tokyo Institute of Technology
Laboratory for Future Interdisciplinary Research of Science and Technology, Tokyo Institute of Technology
CREST, Japan Science and Technology Agency
Takashi Nagoshi
National Institute of Advanced Industrial Science and Technology
Equo Kobayashi
Department of Materials Science and Engineering, Tokyo Institute of Technology
Hideki Hosoda
Laboratory for Materials and Structures, Tokyo Institute of Technology
Laboratory for Future Interdisciplinary Research of Science and Technology, Tokyo Institute of Technology
Tatsuo Sato
Laboratory for Materials and Structures, Tokyo Institute of Technology
Laboratory for Future Interdisciplinary Research of Science and Technology, Tokyo Institute of Technology
Masato Sone
Laboratory for Materials and Structures, Tokyo Institute of Technology
Laboratory for Future Interdisciplinary Research of Science and Technology, Tokyo Institute of Technology
CREST, Japan Science and Technology Agency

Keywords: micro-tensile test, pure copper, copper-nickel-silicon, precipitation strengthening, work hardening

JOURNAL FREE ACCESS Advance online publication

Article ID: M2016188

DOI https://doi.org/10.2320/matertrans.M2016188

The final version of this article is now available: Vol. 57 (2016), No. 11 pp. 1897-1901

Details

Abstract

Micro-tensile tests of pure copper and a precipitation strengthening-type Cu alloy, Cu-Ni-Si alloy, were performed using micro-sized tensile specimens with 10 × 10 µm² in cross-section and 40 µm in length and a micro-gripper, which were fabricated by a focused ion beam system. The obtained experimental results were compared with the results of Cu-Ni-Si alloy bulk sample. The micro-tensile tests of both pure Cu and Cu-Ni-Si alloy showed the typical serrations caused by moving of dislocations and a decrease of flow stress by the necking. In the Cu-Ni-Si alloy, characteristic deformation of work-hardening was observed. Electron back scatter diffraction analysis showed a gradual change in crystal orientation at the necking area.

Corresponding author

Register with J-STAGE for free!