MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678

This article has now been updated. Please use the final version.

Solderability of Bulk Metallic Glasses Using Lead-Free Solders
Hiroshi NishikawaKrit WongPiromsarnHiroya AbeTadashi TakemotoMikio FukuharaAkihisa Inoue
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JOURNAL RESTRICTED ACCESS Advance online publication

Article ID: ME200824

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Abstract
A feasibility study has been conducted to determine whether the low temperature joining process such as soldering process and wire bonding process can be applied to join a bulk metallic glass (BMG) to a BMG and a BMG to a crystalline metal. Therefore, in order to evaluate the solderability of BMGs, the spread test of the solder was basically performed for three kind of BMGs in this study. As a result, Pd-based BMG exhibited a good wetting behavior of the solder at 503 K and 523 K. On the other hand, concerning Cu-based and Zr-based BMGs, there was no wetting of the solder on the surface of BMGs regardless of the peak temperature. Then the ultrasonic soldering process was tested to establish the joint process for BMGs. It was clear that the application of ultrasonic is effective to the soldering process.
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© 2009 The Japan Institute of Metals and Materials
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