Article ID: MT-M2019277
Mg-clad Al materials with a Ni foil interlayer were successfully prepared by vacuum roll bonding at a 450°C rolling temperature and 25% reduction, and the effects of the Ni foil interlayer on the interfacial properties were investigated. The clad materials with the Ni foil interlayer only formed the Mg2Ni intermetallic compound with a 0.9 µm thickness on the Mg–Ni interface, which was smaller than that of the intermetallic compounds (Al12Mg17 of 1.77 µm and Al3Mg2 of 7.76 µm) formed on the Al–Mg interface without the interlayer. The bonding strength of the interface increased from 0.79 MPa to 10.46 MPa. The growth characteristics of the Mg2Ni intermetallic compound on the Mg–Ni interface after heat treatment were investigated. The growth activation energy of Mg2Ni was 157.24 kJ/mol, which is higher than that of Al3Mg2 which mainly affects the Al–Mg interfacial bonding strength. Therefore, the thickness of the Mg2Ni was thinner and the interfacial bonding strength was greater after the vacuum roll bonding.
