抄録
Cracks were formed along grain boundaries and along deformation bands in the interior of a grain in copper bulk bicrystals which had been compressed at room temperature, and then annealed in a vacuum at 823 K without unloading. It is considered that the cracks along grain boundaries and deformation bands were formed by strain induced premelting; when localized regions with high dislocation density are formed close to grain boundaries or deformation bands, the regions may melt at temperatures of approximately 0.5TM (TM: the melting point in Kelvin). Premelting cracks along deformation bands were found for the first time in this study. It was found that the development of premelting cracks was closely related to the duration of the compressive load without a large drop during the heating process. Various experimental parameters which affect the formation and development of premelting cracks are discussed.
