Proceedings of Microelectronics Symposium
Online ISSN : 2434-396X
MES2011
Conference information

Host: Japan Institute of Electronics Packaging

MES2011
The influence of lead and sulfur contained in electroless nickel plating film on the reliability of solder joint with the electroless Ni/ Pd/Au plating
*[in Japanese], [in Japanese], [in Japanese], [in Japanese]
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CONFERENCE PROCEEDINGS FREE ACCESS

Pages 145-148

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© 2011 The Japan Institute of Electronics Packaging
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