Proceedings of Microelectronics Symposium

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MES2011

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MES2011

Fabrication of interfacial nanostructures at metal/resin interface and metallic patterns by chemical deposition method

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 1-4
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_1

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Development of Ag-based Composites Containing Carbon Nanotubes as A Novel Thermal Interface Material

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 5-8
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_5

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Die bonding materials for low temperature joinning with Ag flakes

[in Japanese], [in Japanese]

Pages 9-12
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_9

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Silver-Copper Bimetallic Nanoparticles for Wiring Material with Resistance to Ionic Migration

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 13-16
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_13

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Synthesis and Properties of Colorless and High-temperature Plastics—Alicyclic Polyimides Having Norbornane Structure—

[in Japanese]

Pages 17-20
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_17

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OPTICAL AND THERMAL PROPERTIES OF TRANSPARENT EPOXY/ZIRCONIA HYBRID MATERIALS SYNTHESISZED VIA IN-SITU POLYMERIZATION

[in Japanese], [in Japanese], [in Japanese]

Pages 21-24
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_21

CONFERENCE PROCEEDINGS FREE ACCESS

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Curable liquid resin for optical interconnects

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 25-28
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_25

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Development of New Type Eco-material Soft Actuator

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 29-32
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_29

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Hybird High μ Material

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 33-36
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_33

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Deposition of Copper Circuit on Polymer Film using Pd-Nanoparticle/Acrylic Polymer Hybrid Interlayer

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 37-40
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_37

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Direct Copper Electrodeposition on Transparent Conductive ITO Film from Ethylenediamine Complex bath

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 41-44
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_41

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The influence of glass component in conductor paste on plating process

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 45-48
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_45

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Development of processing of micro-via using 4th-YAG Laser

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 49-52
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_49

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A study about the defect detection system with capacitance to occur in the neighborhood of the printed wiring

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 53-56
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_53

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Influence of Crystallographic Structure on Etch Rate of Copper by using Ammonium Peroxodisulfate Solution

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 57-60
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_57

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Adsorption and desorption behavior of organic additives during copper electrodeposition by a microfluidic reactor with rapid solution exchange system

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 61-64
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_61

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Adhesive strength of copper plating films on colorless polyimide sheets fabricated by Direct Metallization Process

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 65-68
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_65

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Development of an Wet/Dry Hybrid Deposition to Form ITO

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 69-72
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_69

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A Short Defect Position Identification Method through Magnetic Coupling for TFT Pattern

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 73-76
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_73

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Development of R2R film Inspection system for LiB

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 77-80
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_77

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High speed CT technique for total inspection in production line

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 81-84
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_81

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Absorption-type Micro Computed Tomography Observations On Microstructure Changes of Optical Fibers Spliced by CO₂ Laser Irradiation

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 85-88
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_85

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Development of Thermal Warpage Simulation of Module Product

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 89-92
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_89

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Method for optimize heat analysis simulation and electromagnetic field simulation for optical transceiver

[in Japanese], [in Japanese], [in Japanese]

Pages 93-96
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_93

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Evaluation of Uniaxial-Stress Effects on nMOSFETs

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 97-100
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_97

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Mechanical simulation for Pre-applied Underfill process

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 101-104
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_101

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Thermal Conductivity of Liquid Crystalline Epoxy/BN composites Ordered by a Magnetic Field

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 105-108
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_105

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Development of Thermal Dissipation Circuit Board by Using Soluble LCP

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 109-112
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_109

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Electronic Contribution to Thermal Transport Property in Ther-mally Conductive Adhesives Containing Various Fillers

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 113-116
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_113

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The 3D-visualization of conductive pathway between electrodes in conductive adhesive

[in Japanese], [in Japanese], [in Japanese]

Pages 117-120
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_117

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Photoelastic Polymer Sensor

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 121-124
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_121

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Properties of Epoxy/Phenoxy Containing Phosphorus Adhesives for Halogen-free Flame-retardant Cover Lays

[in Japanese], [in Japanese], [in Japanese]

Pages 125-128
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_125

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Electroless Plating and Demonstration of Forming Fine Lines on Polyimide-film

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 129-132
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_129

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Functional low-CTE substrate using an ultra low-CTE polyimide

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 133-136
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_133

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Electroless plating technology for narrow pitch circuit

[in Japanese], [in Japanese], [in Japanese]

Pages 137-140
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_137

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Copper Filling using Diallylamine Leveler Additives

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 141-144
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_141

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The influence of lead and sulfur contained in electroless nickel plating film on the reliability of solder joint with the electroless Ni/ Pd/Au plating

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 145-148
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_145

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Fabrication of Sn-Cu alloy by electroplating and evaluation of film properties

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 149-152
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_149

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Heat-and Sulfurization-Resistant Laminated Structure for LED Lighting System

[in Japanese], [in Japanese], [in Japanese]

Pages 153-156
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_153

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High Reliability Mold-Underfill Material and Encapsulation Process for SIP

[in Japanese], [in Japanese], [in Japanese]

Pages 157-160
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_157

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Investigation of Underfill Fillet and Thermal Stress of Flip Chip BGA Package

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 161-164
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_161

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Study on Material System Solution for Newly Package

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 165-168
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_165

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Pb-free area-array flipchip package reliability study for fine pitch

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 169-172
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_169

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Electromigration Failure Simulation and Synchrotron Radiation X-Ray Microtomography of Flip-Chip Solder Joint

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 173-176
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_173

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Analytical Study on Dispersion of Thermal Fatigue Life of IVH (Interstitial Via Hole) in PWB (Printed Wiring Board)

[in Japanese], [in Japanese]

Pages 177-180
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_177

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A study of crystal anisotropy for a lead-free solder material

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 181-184
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_181

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Temperature profile definition by thermal property measurement and transition simulation model of PBGA (Plastic Ball Grid Array)

[in Japanese]

Pages 185-188
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_185

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Thermal resistance change by micro-delamination in a small semi-conductor package

[in Japanese], [in Japanese], [in Japanese]

Pages 189-192
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_189

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Joining Method for Thin Si Chips

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 193-196
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_193

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Formation of Cu-TSV by All-Wet Process Using Electroless Barrier Metal

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 197-200
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_197

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