MES2011
Conference information
Host: Japan Institute of Electronics Packaging
MES2011
Electromigration Failure Simulation and Synchrotron Radiation X-Ray Microtomography of Flip-Chip Solder Joint
*[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]
Author information
Pages 173-176
Details
Article 1st page
