Proceedings of Microelectronics Symposium
Online ISSN : 2434-396X
MES2011
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Host: Japan Institute of Electronics Packaging

MES2011
Temperature profile definition by thermal property measurement and transition simulation model of PBGA (Plastic Ball Grid Array)
*[in Japanese]
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CONFERENCE PROCEEDINGS FREE ACCESS

Pages 185-188

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© 2011 The Japan Institute of Electronics Packaging
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