MES2012
Conference information
Host: Japan Institute of Electronics Packaging
MES2012
Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Flipchip Solder Joints by Synchrotron Radiation X-Ray Laminography
*[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]
Author information
Pages 207-210
Details
Article 1st page
