Proceedings of Microelectronics Symposium

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MES2012

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MES2012

[title in Japanese]

[in Japanese]

Pages 1-10
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_1

CONFERENCE PROCEEDINGS FREE ACCESS

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[title in Japanese]

[in Japanese]

Pages 11-18
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_11

CONFERENCE PROCEEDINGS FREE ACCESS

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SiC Power Device Packaging Tasks and World Development Trend

[in Japanese]

Pages 19-24
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_19

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Improve the thermal stability of epoxy molding resins containing nanofiller

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 25-28
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_25

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Development of aluminum nitride substrate for high power device

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 29-30
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_29

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Study on Au-Au Bonding Process of SiC Power Device for High Temperature Operation

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 31-34
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_31

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Wire Bonding For High Temperature Power Devices

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 35-38
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_35

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Bond reliability of Ag wire

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 39-42
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_39

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High Temperature Pb-free Solder using Clad Material

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 43-46
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_43

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Bump Structure Study for Fine Pitch Flip Chip Interconnection

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 47-50
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_47

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Hydrogen radical cleaning by Hot-Wire method for flip chip bonding ～Evaluation of re-oxidization control effect～

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 51-52
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_51

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A robustness study on self-alignment of thin-Si dies using surface tension

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 53-56
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_53

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A New Bonding Technology in Simultaneus Press Prosess

[in Japanese], [in Japanese], [in Japanese]

Pages 57-60
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_57

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Investigation of Optimized CPW Structure Design for High-Density Flip-Chip Interconnects including Micro Au Bumps

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 61-64
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_61

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Thermal and Optical Properties of Epoxy/Zirconia Hybrids Synthesized via In-situ Polymerization

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 65-68
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_65

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Low-Temperature Glass for Low-Expansion Substrate

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 69-72
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_69

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Hierarchical Surface Modification of Bio-Interface Material with Self-resilience for the Improvement of Printing Property

[in Japanese]

Pages 73-74
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_73

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High Thermal Conductive ICF Material depended on Inorganic Filler for 3D-IC

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 75-78
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_75

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Pre-processing and post-processing technology of direct copper CO2 laser drilling

[in Japanese]

Pages 79-82
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_79

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Influence of Crystallographic Structure on Etching Rate of Copper by use of Sulfuric Acid/Hydrogen Peroxide Solution

[in Japanese], [in Japanese], [in Japanese]

Pages 83-86
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_83

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Flexible Optical-Electrical PWB by Transfering Micro-Mirror Process

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 87-90
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_87

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Development of a Double-Sided Polymide FPC by the direct metalization on polyimide surface

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 91-92
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_91

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Characterization of double-sided FPC plated directly on polyimide film

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 93-96
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_93

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Materials Design of Thermally Conductive Hybrid Materials

[in Japanese]

Pages 97-100
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_97

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Development of Encapsulated Resin Material for Wide Band Gap Semiconductor Devices

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 101-104
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_101

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Thermal Conductivity of Liquid Crystalline Epoxy Resin Having Low Melting Point

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 105-106
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_105

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Packaging Technologies for Power Device

[in Japanese]

Pages 107-110
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_107

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Development of Low-Temperature Sintering Cu Nanoparticles

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 111-114
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_111

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Effect of joining conditions on bondability of Cu nanoparticle paste

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 115-116
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_115

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Development of bonding materials using copper-oxide particles for the use of high temperature environment and elucidation of bonding mechanism

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 117-120
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_117

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Development of Low Cost Multifiber Connector for Optical Interconnect

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 121-122
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_121

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Micromachining on the cross section of PMMA optical fibers using Proton Beam Writing

[in Japanese], [in Japanese], [in Japanese]

Pages 123-124
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_123

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Fast film thickness profiler based on interference color

[in Japanese], [in Japanese], [in Japanese]

Pages 125-126
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_125

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Development of LIGA Process Using Proton Beam Writing for Local Imprint Process and Its Applications

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 127-130
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_127

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Repair for Circuit Wiring Pattern Defects Using Droplet Dispenser Systems

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 131-134
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_131

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A Study on Selective Deposition on Electrodes of Chip Component

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 135-138
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_135

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Investigation on direct plating for treatment of thin Cu/PI layers

[in Japanese], [in Japanese]

Pages 139-140
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_139

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The influence of Additives in Lead-free Electroless Nickel Plating Film on the Reliability of Solder Joint

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 141-144
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_141

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Electrodeposition of Chromium and Aluminum from Ionic Riquid Bath

[in Japanese], [in Japanese], [in Japanese]

Pages 145-146
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_145

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Adsorption and desorption behavior of organic additives during copper electrodeposition by a microfluidic reactor with rapid solution exchange system

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 147-150
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_147

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Adhesion Force between Electroless Plated Ni-P Film Substrates, Three Kinds Materials and Glass

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 151-152
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_151

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Perfectly via filling electrodeposition of 4µm diameter via due to controlling periodical reverse current

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 153-154
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_153

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Fabrication of Ni structure by electrodeposition

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 155-156
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_155

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Development of the wire grid polarizer using deposition process

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 157-158
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_157

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Thermal shock test on low-Ag Sn-Ag-Cu-Zn solder

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 159-162
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_159

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Improvement of the accuracy of the nonlinear finite element analyses for a 3D SIC package using the thermal strain measurement with scanning electron microscope and the digital image correlation.

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 163-166
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_163

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Effects of Sb and Zn Addition on Impact Resistance Improvement of Sn-Bi Solder Joints

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 167-170
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_167

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Influence of UBM Layers on Electromigration Behavior of Micro-joints Using Sn-Bi Eutectic Solders

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 171-174
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_171

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Device Simulation for Stress Effects Considering Stress Concentration and Variations of Intrinsic Carrier Density in nMOSFETs

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 175-178
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_175

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Degradation prospect of crystal silicon solar cell by FEM

[in Japanese], [in Japanese]

Pages 179-182
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_179

CONFERENCE PROCEEDINGS FREE ACCESS

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