Proceedings of Microelectronics Symposium
Online ISSN : 2434-396X
MES2012
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Host: Japan Institute of Electronics Packaging

MES2012
Bump Structure Study for Fine Pitch Flip Chip Interconnection
*[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]
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CONFERENCE PROCEEDINGS FREE ACCESS

Pages 47-50

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© 2012 The Japan Institute of Electronics Packaging
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