MES2013
Conference information
Host: Japan Institute of Electronics Packaging
MES2013
Development of the Next Generation Buried Bump Interconnection Technology (B2itTM) to Realize Finer Bump, Finer Line/Space, Thinner Substrate and Higher Speed Signal Transmission
*[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]
Author information
Pages 305-308
Details
Article 1st page
