Proceedings of Microelectronics Symposium

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MES2013

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MES2013

Development Trend of SiC Power Device Packaging Task & Materials

[in Japanese]

Pages 13-16
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_13

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Aluminum Based High Thermal Conductive Composite Containing Carbon Nantube-Carbon Fiber Network

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 17-20
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_17

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High Thermal Conductive Sheet with Controlled Vertically Oriented Carbon Fiber

[in Japanese], [in Japanese], [in Japanese]

Pages 21-24
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_21

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A study on decision method for thermal boundary condition and life of Power Device

[in Japanese], [in Japanese], [in Japanese]

Pages 25-28
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_25

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High-Reliability Power Modules

[in Japanese]

Pages 29-32
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_29

CONFERENCE PROCEEDINGS FREE ACCESS

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Silver nanoparticle pastes for non-pressure die-attach of semiconductor devices at low temperatures

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 33-36
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_33

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Evaluation of Die-bond Reliability using Silver Nano Paste and AlN substrate

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 37-40
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_37

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The development of high temperature lead-free soldering by bismuth plating layer

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 41-44
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_41

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Hybridization of epoxy resin including solder particles with thermoplastic resin film and chip mountability

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 45-48
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_45

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Effect of Resin Properties on Electrical, and Thermal Characteristics of Epoxy/Silver Composite

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 49-52
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_49

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Influence of Mullins Effect on Electrical Conductivity of Stretchable Printed Wires

[in Japanese], [in Japanese], [in Japanese]

Pages 53-56
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_53

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Microstructural Control of Electrically Conductive Adhesives Based on Binder Chemistry

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 57-60
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_57

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Development of Touch Panel System by Single Layer without Pattern

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 61-64
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_61

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Compact Polarization Sensors Integrated with wire-grid polarizers

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 65-68
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_65

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Development of capacitance type inspection system for Device Embedded Substrate

[in Japanese]

Pages 69-72
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_69

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Development of high-precision measurement technique to determine RF circuit constant with embedded passive components

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 73-76
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_73

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Radiation patterns of wideband antenna with a slit builｔ on printed circuit board

[in Japanese], [in Japanese], [in Japanese]

Pages 77-80
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_77

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Bent Type of UWB Antenna Built in Electronic Equipment -Investigation of Radiation Pattern-

[in Japanese], [in Japanese], [in Japanese]

Pages 81-84
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_81

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Millimeter-wave slotted-antenna array using left-handed waveguide - Control of radiation pattern by loading capacitor -

[in Japanese], [in Japanese], [in Japanese]

Pages 85-88
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_85

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A Flexible Wideband Antenna with Fan-Shaped and Trapezoidal Elements for Ultra Wideband Radio

[in Japanese], [in Japanese], [in Japanese]

Pages 89-92
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_89

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Electromagnetic Field Analyses for a Broadband Antenna Building into Smartphone for Third-Generation Mobile and UWB Communication including the Effects of the Human Hand

[in Japanese], [in Japanese], [in Japanese]

Pages 93-96
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_93

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Improvement of Conducted Emission Reduction Characteristics in a Power Layer using EBG Structure

[in Japanese], [in Japanese], [in Japanese]

Pages 97-100
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_97

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Investigation of Coupling Coefficient Characteristics between Printed Spiral Coil and Simple Loop Coil

[in Japanese], [in Japanese], [in Japanese]

Pages 101-104
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_101

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Comparison of Wireless Power Transfer Characteristics Using Circular-Coil Array and Elliptical Coil as a Transmission Coil

[in Japanese], [in Japanese], [in Japanese]

Pages 105-108
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_105

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Input Impedance Characteristics of Stationary Transceivers in Human Body Communication

[in Japanese], [in Japanese], [in Japanese]

Pages 109-112
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_109

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Fabrication of GaN-based Light Emitting Diode Containing Transparent Electrode Formed by Printing of Nanoparticle Pastes

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 113-116
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_113

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Fine Patterning Method of Copper on Polyimide Film with High Adhesion Strength

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 117-120
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_117

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Formation of the Electroless Copper Plating to Polysilsesquioxane Film Containing Palladium Catalyst

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 121-124
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_121

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Electroless Copper Plating applicable to Printable Electronics

[in Japanese], [in Japanese], [in Japanese]

Pages 125-128
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_125

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Current State and Future Agenda in Development of High Heat-releasable Polymer Materials

[in Japanese]

Pages 129-132
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_129

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Aditional Modification of the Surface of BN Particles and Properties of the Epoxy Resin Composite with Those Prticles

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 133-136
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_133

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Package and Assembly Technologies fir Power Semiconductor Modules

[in Japanese], [in Japanese], [in Japanese]

Pages 137-142
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_137

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Room Temperature Bonding of Wafers and Metals using Au Films in Air

[in Japanese], [in Japanese], [in Japanese]

Pages 143-146
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_143

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Development of Die-bonding Technique with High Temperature Resistant Joining Materials

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 147-150
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_147

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Interfacial reaction of Zn-0.1Cr high temperature solder and Cu/Ni substrates

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 151-154
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_151

CONFERENCE PROCEEDINGS FREE ACCESS

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Packaging Technology for Automotive Power Electronics

[in Japanese]

Pages 155-158
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_155

CONFERENCE PROCEEDINGS FREE ACCESS

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Thermal Simulation of Cu Nanoparticle Joints for Power Semiconductor Device

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 159-162
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_159

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Thermal characterizations of Cu nanoparticle joints

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 163-166
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_163

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New Trends of Embedded Active & Passive Substrates

[in Japanese]

Pages 167-170
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_167

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Reliability Test of Devices Embedded inside Substrates using Bending Methods

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 171-174
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_171

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Organic Interposer with Embedded Thin Film Capacitors

[in Japanese], [in Japanese]

Pages 175-178
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_175

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Latest Embedded Technology Trend using Laser Via Interconnection

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 179-184
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_179

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Polyimide Multilayer Module Board Embedded with Active Devices

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 185-188
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_185

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Embedded-die type 3D package

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 189-192
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_189

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Development of New Electroless Palladium Plating Process for Improvement of Solderability on Printed Wiring Board

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 193-196
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_193

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Influence of Surface Finishes and Solder Alloys on Solder Ball Joint Reliability

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 197-200
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_197

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Investigation of Electroless Ni/Ag Plating Process for Printed Circuit Board

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 201-204
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_201

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Development of Electroless Ag Plating Process for Au Wire Bonding

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 205-208
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_205

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Study of a highly adhesive electroless barrier layer and its application to TSV process

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 209-212
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_209

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Diallylamine levelers side chains effect on copper via filling

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 213-216
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_213

CONFERENCE PROCEEDINGS FREE ACCESS

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